Integrated Circuit Design Engineer II/III

				Overview:

Seeking MMIC Design Engineers/Senior MMIC Design Engineers for an exciting opportunity with the MMIC Design Center organization under CAES Defense Systems, located in either our Richardson, TX or Forsyth, MO locations! The MMIC Design Center is comprised of a team of 20+ MMIC and Packaging Designers creating advanced RF solutions for internal and external customers. The Center has PMO, test and test support engineering to convert designs into delivered products as well as systems expertise to support customer architectures and trade studies also enabling CAES capabilities at board and sub-array levels. Consider joining us! Apply today.

Come work in a small team environment to co-develop innovative, leading-edge GaN / GaAs technology MMICs for Defense Electronics systems; ground and airborne-based radars, electronic warfare and space applications ranging from L-band to above Ka-band; assist in architecture development and feasibility studies; assist in advanced package concepts through development; perform modeling, simulations, and analyses necessary and hold successful design reviews with customers; assist in mask release to the foundry; assist in manufacturing & test readiness; work in lab alongside technicians to assist in validation & device characterization testing;  prepare technical reports; collaborate with various organizations and cross-functional teams within CAES; work with internal and external vendors as required; support or lead in IR&D efforts; apply appropriate standards, processes, procedures and tools throughout the system development life cycle

Responsibilities:

ESSENTIAL FUNCTIONS and DUTIES:

* Perform line-up analysis, floor planning, FET device selection, and circuit topology studies necessary to meet customer requirements.
* Perform circuit simulation, analyses, and layout as part of the design flow methodology.
* Perform circuit modeling and simulations using foundry PDK models (linear, non-linear, and EM).
* Perform 3D modeling and simulations for packaging MMIC's; work with drafters and PCB designers to develop packages and/or multi-chip modules.
* Perform simulations using Cadence/AWR AXIEM 3D planar EM and Analyst 3D FEM tools.
* Perform analyses required to achieve reliability & manufacturing compliance.
* Prepare for design reviews and preparing for manufacturing and test readiness.
* Perform RF/Microwave measurements in the lab using PNA-X and related equipment.
* Support Engineering team in customer support activities and preparing technical reports.
* Collaborate in team meetings and activities.
* May Be Lead Engineer to assist in planning, reporting, and meeting performance, cost, and schedule objectives on programs.
* May Assist in IR&D roadmaps and lead IR&D projects on advanced technology issues.
* May Identify and contribute in continuous improvement initiatives.
* May Assist in technical write-ups for proposals and white papers.
* May Mentor Engineers.

Qualifications:

Minimum: 

* Bachelor of Science degree in Electrical Engineering (BSEE).
* Two (2) years of RF circuit design or related experience.
* Advanced coursework in RF Design & Communication Systems or similar.
* Hands-on experience using PNA-X Network Analyzer and/or related test equipment in lab environment.
* Comprehensive knowledge of radar and communication system architectures.
* This position requires access to technology, materials, software or hardware that is controlled by US export law. In order to be eligible for this position, you must be a "US Person" under US export laws (or eligible for approval under a U.S. Government export license).
* Ability to obtain and maintain a security clearance.

Preferred:

* Five (5)+ years of experience in MMIC design on III-V compound semiconductors.
* Comprehensive knowledge in several specialty areas such as device modeling, III-V reliability, ESD control and design for best practices, radiation hardness, hydrogen poisoning for example.
* Fundamental knowledge of III-V technology process flow and device physics.
* Comprehensive knowledge of IC packaging; modeling, manufacturing process, and reliability.
* Proficient using PNA-X Network Analyzer and associated test equipment and can work independently in the lab using test equipment to measure s-parameters, power, and two-tone measurements.
* Comprehensive knowledge of radar and communication systems architectures.
* Excellent written, verbal communication and presentation skills.
* Strong analytical skills, attention to detail, critical thinking, and fast learner.
* Ability to work individually and in a team environment and self-motivated.
* Time Management & Organizational skills: adaptability to changing priorities and assignments; ability to maintain confidentiality; ability to focus on task at hand and meet expected time completion (ETC); ability to keep an organized work station and materials.

Salary Range: $85,481.43 -  $162,508  annually (Richardson, TX OR Forsyth, MO).

Employees may be eligible for a discretionary bonus in addition to base bay. Applicable pay within the posted range may vary based on factors including, but not limited to, geographical location, job function of the position, education, and experience of the successful candidate. CAES provides a variety of benefits including health insurance coverage, life and disability insurance, 401K, paid holidays and vacation.
			

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